Development of SnAg-based lead free solders in electronics packaging. - Liang Zhang; Cheng-wen He; Yong-huan Guo; Ji-guang Han; Yong-wei Zhang; Xu-yan Wang (Microelectron. Reliab., 2012)

Anand model and FEM analysis of SnAgCuZn lead-free solder joints in wafer level chip scale packaging devices. - Liang Zhang; Ji-guang Han; Yong-huan Guo; Cheng-wen He (Microelectron. Reliab., 2014)