Evaluating the material properties of underfill for a reliable 3D TSV integration package using numerical analysis. - Hyungseok Yoon; Kwang-Seong Choi; Hyun-Cheol Bae; Jong-Tae Moon; Yong-Sung Eom; Insu Jeon (Microelectron. Reliab., 2017)

Development of Laser-Assisted Bonding with Compression (LABC) Process for 3D IC Integration. - Kwang-Seong Choi; Yong-Sung Eom; Seok Hwan Moon; Jiho Joo; Kwangjoo Lee; Jung Hak Kim; Ju Hyeon Kim (3DIC, 2019)