Three-dimensional pose estimation based on LS-SVM error compensation. - Ronghua Li; Yongfang Hu; Shuaifang Wen; Qingling Fan (URAI, 2016)

Hermetic Interlayer Interconnection Technology Based on SAC305 Solder Paste. - Yongfang Hu; Kun Yan; Ziyuan Wang; Liuwei Wang; Yipeng Sun; Yuefei Wang; Xinlong Zhang; Zongjie Han; Qingan Huang; Lei Han (CECNet, 2023)