Constitutive modeling on creep deformation for a SnPb-based composite solder reinforced with microsized Cu particles. - Yaowu Shi; Yanfu Yan; Jianping Liu; Zhidong Xia; Yongping Lei; Fu Guo; Xiaoyan Li (Microelectron. Reliab., 2010)

Experimental analysis of Sn-3.0Ag-0.5Cu solder joint board-level drop/vibration impact failure models after thermal/isothermal cycling. - Jian Gu; Jian Lin; Yongping Lei; Hanguang Fu (Microelectron. Reliab., 2018)