Three-Tier 3D ICs for More Power Reduction: Strategies in CAD, Design, and Bonding Selection. - Taigon Song; Shreepad Panth; Yoo-Jin Chae; Sung Kyu Lim (ICCAD, 2015)

More Power Reduction With 3-Tier Logic-on-Logic 3-D ICs. - Taigon Song; Shreepad Panth; Yoo-Jin Chae; Sung Kyu Lim (IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2016)