Low-ESL (<1 pH @ 8.5 GHz) Multi-Terminal Si Capacitor Embedded in 3D Functional Interposer for Power Delivery Network. - Kyosuke Kobinata; Tatsuya Funaki; Yoshiaki Satake; Hitoshi Matsuno; Seiji Hidaka; Shunsuke Abe; Hiroyuki Ito; Chih-Cheng Hsiao; Sheng Yi Li; Young-Suk Kim; Takayuki Ohba (VLSI Technology and Circuits, 2022)

Face-Down and Heterogeneous Chip Bonding Technology on Waffle-Wafer for Bumpless Chip-an-Wafer (COW) Package. - Yoshiaki Satake; Tatsuya Funaki; Wataru Doi; Hajime Kato; Shogo Okita; Takayuki Ohba (3DIC, 2024)