Performance analysis of subband adaptive systems using an equivalent model. - Yoshihiro Ono; Hitoshi Kiya (ICASSP (3), 1994)

High density and reliable packaging technology with Non Conductive Film for 3D/TSV. - Kentaro Mori; Yoshihiro Ono; Shinji Watanabe 004; Toshikazu Ishikawa; Michiaki Sugiyama; Satoshi Imasu; Toshihiko Ochiai; Ryo Mori; Tsuyoshi Kida; Tomoaki Hashimoto; Hideki Tanaka; Michitaka Kimura (3DIC, 2013)