Copper-filled anodized aluminum oxide a potential material for chip to chip bonding. - Kosuke Yamashita; Shunji Kurooka; Koji Shirakawa; Yoshinori Hotta; Hirofumi Abe (3DIC, 2015)

Cu-Cu Bonding Challenges with 'i-ACF' for Advanced 3D Integration. - Shunji Kurooka; Yoshinori Hotta; Ai Nakamura; Mitsumasa Koyanagi; Takafumi Fukushima (3DIC, 2019)