Low-cycle fatigue testing and thermal fatigue life prediction of electroplated copper thin film for through hole via. - Kazuki Watanabe 006; Yoshiharu Kariya; Naoyuki Yajima; Kizuku Obinata; Yoshiyuki Hiroshima; Shunichi Kikuchi; Akiko Matsui; Hiroshi Shimizu (Microelectron. Reliab., 2018)