A proposal of writer verification of hand written objects. - Yosuke Kato; Takayuki Hamamoto; Seiichiro Hangai (ICME (2), 2002)

D-Pen: a digital pen system for public and business enterprises. - Naohiro Furukawa; Hisashi Ikeda; Yosuke Kato; Hiroshi Sako (IWFHR, 2004)

A 120mm2 16Gb 4-MLC NAND Flash Memory with 43nm CMOS Technology. - Kazushige Kanda; Masaru Koyanagi; Toshio Yamamura; Koji Hosono; Masahiro Yoshihara; Toru Miwa; Yosuke Kato; Alex Mak; Siu Lung Chan; Frank Tsai; Raul Cernea; Binh Le; et al. (ISSCC, 2008)

A 151mm2 64Gb MLC NAND flash memory in 24nm CMOS technology. - Koichi Fukuda; Yoshihisa Watanabe; Eiichi Makino; Koichi Kawakami; Jumpei Sato; Teruo Takagiwa; Naoaki Kanagawa; Hitoshi Shiga; Naoya Tokiwa; Yoshihiko Shindo; Toshiaki Edahiro; Takeshi Ogawa; et al. (ISSCC, 2011)

A 19nm 112.8mm2 64Gb multi-level flash memory with 400Mb/s/pin 1.8V Toggle Mode interface. - Noboru Shibata; Kazushige Kanda; Toshiki Hisada; Katsuaki Isobe; Manabu Sato; Yui Shimizu; Takahiro Shimizu; Takahiro Sugimoto; Tomohiro Kobayashi; Kazuko Inuzuka; Naoaki Kanagawa; Yasuyuki Kajitani; et al. (ISSCC, 2012)

A 151-mm2 64-Gb 2 Bit/Cell NAND Flash Memory in 24-nm CMOS Technology. - Koichi Fukuda; Yoshihisa Watanabe; Eiichi Makino; Koichi Kawakami; Jumpei Sato; Teruo Takagiwa; Naoaki Kanagawa; Hitoshi Shiga; Naoya Tokiwa; Yoshihiko Shindo; Takeshi Ogawa; Toshiaki Edahiro; et al. (IEEE J. Solid State Circuits, 2012)

A 19 nm 112.8 mm2 64 Gb Multi-Level Flash Memory With 400 Mbit/sec/pin 1.8 V Toggle Mode Interface. - Kazushige Kanda; Noboru Shibata; Toshiki Hisada; Katsuaki Isobe; Manabu Sato; Yui Shimizu; Takahiro Shimizu; Takahiro Sugimoto; Tomohiro Kobayashi; Naoaki Kanagawa; Yasuyuki Kajitani; Takeshi Ogawa; et al. (IEEE J. Solid State Circuits, 2013)

11.1 A 512Gb 3b/cell flash memory on 64-word-line-layer BiCS technology. - Ryuji Yamashita; Sagar Magia; Tsutomu Higuchi; Kazuhide Yoneya; Toshio Yamamura; Hiroyuki Mizukoshi; Shingo Zaitsu; Minoru Yamashita; Shunichi Toyama; Norihiro Kamae; Juan Lee; Shuo Chen; et al. (ISSCC, 2017)

A 512Gb 3-bit/Cell 3D Flash Memory on 128-Wordline-Layer with 132MB/s Write Performance Featuring Circuit-Under-Array Technology. - Chang Hua Siau; Kwang-Ho Kim; Seungpil Lee; Katsuaki Isobe; Noboru Shibata; Kapil Verma; Takuya Ariki; Jason Li 001; Jong Yuh; Anirudh Amarnath; Qui Nguyen; Ohwon Kwon; et al. (ISSCC, 2019)

A 1-Tb 4b/Cell 4-Plane 162-Layer 3D Flash Memory With a 2.4-Gb/s I/O Speed Interface. - Jong Yuh; Jason Li 001; Heguang Li; Yoshihiro Oyama; Cynthia Hsu; Pradeep Anantula; Stanley Jeong; Anirudh Amarnath; Siddhesh Darne; Sneha Bhatia; Tianyu Tang; Aditya Arya; et al. (ISSCC, 2022)

A 1-Tb 4-b/cell 4-Plane 162-Layer 3-D Flash Memory With 2.4-Gb/s IO Interface. - Jonghak Yuh; Yen-Lung Jason Li; Heguang Li; Yoshihiro Oyama; Cynthia Hsu; Pradeep Anantula; Gwang Yeong Stanley Jeong; Anirudh Amarnath; Siddhesh Darne; Sneha Bhatia; Tianyu Tang; Aditya Arya; et al. (IEEE J. Solid State Circuits, 2023)

A 1Tb 3b/cell 3D-Flash Memory with a 29%-Improved-Energy-Efficiency Read Operation and 4.8Gb/s Power-Isolated Low-Tapped-Termination I/Os. - Kosuke Yanagidaira; Mario Sako; Yasuhiro Hirashima; Junya Matsuno; Yumi Higashi; Yutaka Shimizu; Akihiro Imamoto; Kazuaki Kawaguchi; Koji Tabata; Takeshi Nakano; Yusuke Ochi; Hiroaki Hoshino; et al. (ISSCC, 2025)