The self-formatting barrier characteristics of Cu-Mg/SiO2 and Cu-Ru/SiO2 films for Cu interconnects. - Seol-Min Yi; Kwang-Ho Jang; Jung-Uk An; Sang-Soo Hwang; Young-Chang Joo (Microelectron. Reliab., 2008)

Electrical Reliability of Cu/Sn Micro-bump in Wafer Level Packaging for BioMEMS Devices. - Myeong-Hyeok Jeong; Jae-Won Kim; Byung-Hyun Kwak; Young-Bae Park; Byoung-Joon Kim; Young-Chang Joo (BIODEVICES, 2011)

Measurement of stresses in Cu and Si around through-silicon via by synchrotron X-ray microdiffraction for 3-dimensional integrated circuits. - Arief Suriadi Budiman; H.-A.-S. Shin; B.-J. Kim; S.-H. Hwang; Ho-Young Son; Min-Suk Suh; Q.-H. Chung; K.-Y. Byun; Nobumichi Tamura; Martin Kunz; Young-Chang Joo (Microelectron. Reliab., 2012)

Successive breakdown mode of time-dependent dielectric breakdown for Cu interconnects and lifetime enhancement under dynamic bias stress. - Sol-Kyu Lee; Kyung-Tae Jang; Seol-Min Yi; Young-Chang Joo (IRPS, 2018)

Super Compaction and Pluripotent Shape Transformation via Algorithmic Stacking for 3D Deployable Structures. - Zhonghua Xi; Yu-Ki Lee; Young-Joo Lee; Yunhyeong Kim; Huangxin Wang; Yue Hao 003; Young-Chang Joo; In-Suk Choi; Jyh-Ming Lien (CoRR, 2018)

Computational paper wrapping transforms non-stretchable 2D devices into wearable and conformable 3D devices. - Yu-Ki Lee; Zhonghua Xi; Young-Joo Lee; Yunhyeong Kim; Yue Hao 003; Young-Chang Joo; Changsoon Kim; Jyh-Ming Lien; In-Suk Choi (CoRR, 2018)

Stress Analysis of Tungsten Deposition in a 3D Trench Mold With Regard to Initial Nuclei Shape. - Jong-Sung Lee; Suncheul Kim; Donghoon Han; Myoung-Gyu Lee; Young-Chang Joo (IEEE Access, 2022)