An investigation of the reliability of solderable ICA with low-melting-point alloy (LMPA) filler. - Byung-seung Yim; Jeong-Il Lee; Byung-Hun Lee; Young-Eui Shin; Jong-Min Kim (Microelectron. Reliab., 2014)

Influence of multi-walled carbon nanotube (MWCNT) concentration on the thermo-mechanical reliability properties of solderable anisotropic conductive adhesives (SACAs). - Byung-seung Yim; Young-Eui Shin; Jong-Min Kim (Microelectron. Reliab., 2018)