Non-conductive film with Zn-nanoparticles (Zn-NCF) for 40 μm pitch Cu-pillar/Sn-Ag bump interconnection. - Jiwon Shin; Il Kim; Yong-Won Choi; Young Soon Kim; Un Byung Kang; Young Kun Jee; Kyung-Wook Paik (Microelectron. Reliab., 2015)