An oversampling method for wafer map defect pattern classification considering small and imbalanced data. - Eun-Su Kim; Seung-Hyun Choi; Dong-Hee Lee; Kwang-Jae Kim; Young-Mok Bae; Young-Chan Oh (Comput. Ind. Eng., 2021)

Approach to derive golden paths based on machine sequence patterns in multistage manufacturing process. - Chang-Ho Lee; Dong-Hee Lee; Young-Mok Bae; Seung-Hyun Choi; Ki-Hun Kim; Kwang-Jae Kim (J. Intell. Manuf., 2022)

Detecting abnormal behavior of automatic test equipment using autoencoder with event log data. - Young-Mok Bae; Young-Gwan Kim; Jeong-Woo Seo; Hyun-A Kim; Chang-Ho Shin; Jeong-Hwan Son; Gyu-Ho Lee; Kwang-Jae Kim (Comput. Ind. Eng., 2023)

Development of taxonomy for classifying defect patterns on wafer bin map using Bin2Vec and clustering methods. - Dong-Hee Lee; Eun-Su Kim; Seung-Hyun Choi; Young-Mok Bae; Jong-Bum Park; Young-Chan Oh; Kwang-Jae Kim (Comput. Ind., 2023)

Development of a spatial dimension-based taxonomy for classifying the defect patterns in a wafer bin map. - Seung-Hyun Choi; Dong-Hee Lee; Eun-Su Kim; Young-Mok Bae; Young-Chan Oh; Kwang-Jae Kim (Adv. Eng. Informatics, 2024)

Phase I change-point detection for ordinal profiles with arbitrary design: A nonparametric method and its application to warranty claims analysis. - Zhiqiong Wang; Lu Zhang; Ying Wang; Lisha Song; Yangyang Zang; Young-Mok Bae (Comput. Ind. Eng., 2025)

Development of a suspiciousness measure with reduced redundancy for screening machine sets in serial-parallel multistage manufacturing processes. - Seung-Hyun Choi; Dong-Hee Lee; Young-Mok Bae; Kwang-Jae Kim (Expert Syst. Appl., 2025)

Set Response Surface Methodology and its Application in Solving the Wrinkle and Crack Problem in the Auto Industry. - Yingdong He; Xinyan Ma; Yu Tian; Zhen He; Xiaoyi Zhang; Kwang-Jae Kim; Young-Mok Bae (IEEE Trans. Reliab., 2025)