An Effective Spare Allocation Methodology for 3D Memory Repair with BIRA. - Seung Ho Shin; Hayoung Lee; Younwoo Yoo; Sungho Kang 001 (ISOCC, 2021)

Post-bond Repair of Line Faults with Double-bit ECC for 3D Memory. - Younwoo Yoo; Hayoung Lee; Seung Ho Shin; Sungho Kang 001 (ISOCC, 2021)

PROG: Per-Row Output Generator for BOST. - Sooryeong Lee; Hayoung Lee; Younwoo Yoo; Seung Ho Shin; Sungho Kang 001 (ISOCC, 2022)

FAME: Fault Address Memory Structure for Repair Time Reduction. - Hayoung Lee; Sooryeong Lee; Younwoo Yoo; Seung Ho Shin; Sungho Kang 001 (ISOCC, 2022)

An Improved Early Termination Methodology Using Convolutional Neural Network. - Seung Ho Shin; Hayoung Lee; Sooryeong Lee; Younwoo Yoo; Sungho Kang 001 (ISOCC, 2022)

ECMO: ECC Architecture Reusing Content-Addressable Memories for Obtaining High Reliability in DRAM. - Hayoung Lee; Younwoo Yoo; Seung Ho Shin; Sungho Kang 001 (IEEE Trans. Very Large Scale Integr. Syst., 2022)

Redundancy Analysis Simplification Scheme for High-Speed Memory Repair. - Hayoung Lee; Younwoo Yoo; Seung Ho Shin; Sungho Kang 001 (ISOCC, 2023)

GPU-Based Redundancy Analysis using Partitioning Method for Memory Repair. - Younwoo Yoo; Hayoung Lee; Seung Ho Shin; Sungho Kang 001 (ISOCC, 2023)

TRUST: Through-Silicon via Repair Using Switch Matrix Topology. - Hayoung Lee; Seung Ho Shin; Younwoo Yoo; Sungho Kang 001 (IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2023)

RAPID: Redundancy Analysis With Parallelized and Intelligent Distribution. - Younwoo Yoo; Hayoung Lee; Seung Ho Shin; Sungho Kang 001 (IEEE Access, 2025)

PETRA: Powerful Early Termination-Based Redundancy Analysis. - Youngkwang Lee; Hyojun Yun; Younwoo Yoo; Sungho Kang 001 (IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2025)