Thermomigration-induced void formation in Cu-interconnects - Assessment of main physical parameters. - Youqi Ding; O. Varela Pedreira; Melina Lofrano; Houman Zahedmanesh; T. Chavez; Hosain Farr; Ingrid De Wolf; Kris Croes (IRPS, 2023)

Challenges for Interconnect Reliability: From Element to System Level. - Olalla Varela Pedreira; Houman Zahedmanesh; Youqi Ding; Ivan Ciofi; Kristof Croes (ISPD, 2023)

De-Coupling Thermo-Migration from Electromigration Using a Dedicated Test Structure. - O. Varela Pedreira; Youqi Ding; D. Coenen; Philippe Roussel; Ahmed Sobhi Saleh; Veerle Simons; Houman Zahedmanesh; Ivan Ciofi; Kris Croes (IRPS, 2024)