Design Considerations and Fabrication Challenges of Surface Electrode Ion Trap with TSV Integration. - Jing Tao; Hongyu Li; Peng Zhao; Yu Dian Lim; Anak Agung Alit Apriyana; Chuan Seng Tan (3DIC, 2019)

Multi-Die to Wafer Bonding Through Plasma-Activated Cu-Cu Direct Bonding in Ambient Conditions. - Liangxing Hu; Simon Chun Kiat Goh; Yu Dian Lim; Peng Zhao; Michael Joo Zhong Lim; Chuan Seng Tan (3DIC, 2021)

Recognizing Beam Profiles from Silicon Photonics Gratings using Transformer Model. - Yu Dian Lim; Hong Yu Li; Simon Chun Kiat Goh; Xiangyu Wang; Peng Zhao; Chuan Seng Tan (CoRR, 2024)