Analysis of thermal stresses in metal interconnects with multilevel structures. - M. S. Kilijanski; Yu-Lin Shen (Microelectron. Reliab., 2002)

On the failure path in shear-tested solder joints. - W. H. Moy; Yu-Lin Shen (Microelectron. Reliab., 2007)

Numerical study of ductile failure morphology in solder joints under fast loading conditions. - Yu-Lin Shen; K. Aluru (Microelectron. Reliab., 2010)

Mechanisms of deformation in high-ductility Ce-containing Sn-Ag-Cu solder alloys. - H. X. Xie; Nikhilesh Chawla; Yu-Lin Shen (Microelectron. Reliab., 2011)

Thermal expansion behavior of through-silicon-via structures in three-dimensional microelectronic packaging. - E. J. Cheng; Yu-Lin Shen (Microelectron. Reliab., 2012)

Misalignment induced shear deformation in 3D chip stacking: A parametric numerical assessment. - Yu-Lin Shen; R. W. Johnson (Microelectron. Reliab., 2013)

Numerical study of microbump failure in 3D microelectronic structures. - Yu-Lin Shen; Geno C. Flores; J. Guthrie (Microelectron. Reliab., 2016)

Detection of Epilepsy Using MFCC-Based Feature and XGBoost. - Jie-Min Long; Zhang-Fa Yan; Yu-Lin Shen; Wei-Jun Liu; Qing-Yang Wei (CISP-BMEI, 2018)

An E-Commerce Coupon Target Population Positioning Model Based on Random Forest and eXtreme Gradient Boosting. - Zhang-Fa Yan; Yu-Lin Shen; Wei-Jun Liu; Jie-Min Long; Qingyang Wei (CISP-BMEI, 2018)