Low temperature (<180 °C) bonding for 3D integration. - Yan-Pin Huang; Ruoh-Ning Tzeng; Yu-San Chien; Ming-Shaw Shy; Teu-Hua Lin; Kuo-Hua Chen; Ching-Te Chuang; Wei Hwang; Chi-Tsung Chiu; Ho-Ming Tong; Kuan-Neng Chen (3DIC, 2013)