A Novel Three-Probability Spaces Logic Decoupling Distillation for Flip-Chip Defect Detection. - Yu Sun 040; Lei Su 002; Jiefei Gu; Ke Li 038; Michael G. Pecht (IEEE Trans. Instrum. Meas., 2023)

Flip-chip solder bumps defect detection using a self-search lightweight framework. - Yu Sun 040; Lei Su 002; Jiefei Gu; Xinwei Zhao; Ke Li 038; Michael G. Pecht (Adv. Eng. Informatics, 2024)

Search for a Dual-Convergence Sparse Feature Extractor With Visualization Vibration Signals Architecture Feature for Flip-Chip Defect Detection. - Yu Sun 040; Lei Su 002; Jiefei Gu; Xinwei Zhao; Ke Li 038; Michael G. Pecht (IEEE Trans. Ind. Informatics, 2024)