First Demonstration of a Design Methodology for Highly Reliable Operation at High Temperature on 128kb 1T1C FeRAM Chip. - Tiancheng Gong; Lihua Xu; Wei Wei; Pengfei Jiang; Peng Yuan; Bowen Nie; Yuanquan Huang; Yuan Wang; Yang Yang; Jianfeng Gao 005; Junfeng Li; Jun Luo; et al. (VLSI Technology and Circuits, 2023)