Hot Stamping of Electric Circuits by 3D Printer. - Yuhei Imai; Kunihiro Kato; Norihisa Segawa; Hiroyuki Manabe (UIST (Adjunct Volume), 2019)

Single-sided Multi-layer Electric Circuit by Hot Stamping with 3D Printer. - Yuhei Imai; Hiroyuki Manabe (UIST (Adjunct Volume), 2021)

A bonding technique for electric circuit prototyping using conductive transfer foil and soldering iron. - Tomohito Suzuki; Yuhei Imai; Hiroyuki Manabe (UIST (Adjunct Volume), 2022)