Pb-free high temperature solders for power device packaging. - Yasushi Yamada; Yoshikazu Takaku; Yuji Yagi; Y. Nishibe; Ikuo Ohnuma; Yuji Sutou; R. Kainuma; Kiyohito Ishida (Microelectron. Reliab., 2006)

Effect of CVD Mn oxide layer as Cu diffusion barrier for TSV. - Mariappan Murugesan; Jichoel Bea; Kang Wook Lee 002; Takafumi Fukushima; Tetsu Tanaka; Mitsumasa Koyanagi; Yuji Sutou; H. Wang; J. Koike (3DIC, 2013)