Impacts of Deposition Temperature and Annealing Condition on Ozone-Ethylene Radical Generation-TEOS-CVD SiO2 for Low-Temperature TSV Liner Formation. - Rui Liang; Sungho Lee; Yuki Miwa; Kousei Kumahara; Mariappan Murugesan; Hisashi Kino; Takafumi Fukushima; Tetsu Tanaka (3DIC, 2019)

Characterization of Low-Height Solder Microbump Bonding for Fine-Pitch Inter-Chip Connection in 3DICs. - Yuki Miwa; Sungho Lee; Rui Liang; Kousei Kumahara; Hisashi Kino; Takafumi Fukushima; Tetsu Tanaka (3DIC, 2019)