Chip-level TSV integration for rapid prototyping of 3D system LSIs. - Kazuyuki Hozawa; Futoshi Furuta; Yuko Hanaoka; Mayu Aoki; Kenichi Takeda; Katsuyuki Sakuma; Kang Wook Lee 002; Takafumi Fukushima; Mitsumasa Koyanagi (3DIC, 2011)