A 137-mW, 4 ch × 25-Gbps Low-Power Compact Transmitter Flip-Chip-Bonded 1.3-μm LD-Array-on-Si. - Toshiki Kishi; Munehiko Nagatani; Shigeru Kanazawa; Shinsuke Nakano; Hiroaki Katsurai; Takuro Fujii; Hidetaka Nishi; Takaaki Kakitsuka; Koichi Hasebe; Kota Shikama; Yuko Kawajiri; Atsushi Aratake; et al. (OFC, 2018)

A 25-Gbps × 4 ch, Low-Power Compact Wire-Bond-Free 3D-Stacked Transmitter Module with 1.3-μm LD-Array-on-Si for On-Board Optics. - Toshiki Kishi; Hitoshi Wakita; Kota Shikama; Munehiko Nagatani; Shigeru Kanazawa; Takuro Fujii; Hidetaka Nishi; Hiroshi Ishikawa; Yuko Kawajiri; Atsushi Aratake; Hideyuki Nosaka; Hiroshi Fukuda; et al. (OFC, 2019)