Optimal Control for a Remanufacturing Reverse Logistics System under Buy-Back Policy. - Xiaochen Sun; Yancong Zhou; Yuling Niu; Guangwei Sun (ISDA (1), 2006)

A Study on the Thermomechanical Reliability Risks of Through-Silicon-Vias in Sensor Applications. - Shuai Shao 002; Dapeng Liu; Yuling Niu; Kathy O'Donnell; Dipak Sengupta; Seungbae Park (Sensors, 2017)

A comprehensive solution for electronic packages' reliability assessment with digital image correlation (DIC) method. - Yuling Niu; Jing Wang; Shuai Shao 002; Huayan Wang; Hohyung Lee; Seungbae Park (Microelectron. Reliab., 2018)