Modeling study of thermosonic flip chip bonding process. - Fuliang Wang; Yun Chen 002 (Microelectron. Reliab., 2012)

Experiment study of dynamic looping process for thermosonic wire bonding. - Fuliang Wang; Yun Chen 002; Lei Han (Microelectron. Reliab., 2012)

Deep Learning-Based Model Reduction for Distributed Parameter Systems. - Mingliang Wang; Han-Xiong Li; Xin Chen 005; Yun Chen 002 (IEEE Trans. Syst. Man Cybern. Syst., 2016)

A direct-drive SCARA robot for wafer&ceramic-substrate handling based on visual servoing. - Yunbo He; Chang Zhang; Wentao Ye; Zuoxiong He; Xin Chen 005; Jian Gao 002; Kai Zhang; Zhijun Yang; Xun Chen 002; Yun Chen 002; Hui Tang 003 (CIS/RAM, 2017)

A Rapid Vibration Reduction Method for Macro-Micro Composite Precision Positioning Stage. - Lanyu Zhang; Jian Gao 002; Xin Chen 005; Hui Tang 003; Yun Chen 002; Yunbo He; Zhijun Yang (IEEE Trans. Ind. Electron., 2017)

Experimental and modeling study on viscosity of encapsulant for electronic packaging. - Xiuyang Shan; Yun Chen 002 (Microelectron. Reliab., 2018)

Dynamic Modeling, Simulation, and Experimental Verification of a Wafer Handling SCARA Robot With Decoupling Servo Control. - Yunbo He; Xiquan Mai; Chengqiang Cui; Jian Gao 002; Zhijun Yang; Kai Zhang; Xun Chen 002; Yun Chen 002; Hui Tang 003 (IEEE Access, 2019)

Triangular Model Registration Algorithm Through Differential Topological Singularity Points by Helmholtz-Hodge Decomposition. - Dongqing Wu; Jian Gao 002; Zhengtao Xiao; Lanyu Zhang; Xin Chen 005; Hui Tang 003; Yun Chen 002; Yunbo He (IEEE Access, 2019)

Rationally Designing the Trace of Wire Bonder Head for Large-Span-Ratio Wire Bonding in 3D Stacked Packaging. - Yun Chen 002; Shuquan Ding; Junyu Long; Maoxiang Hou; Xin Chen 005; Jian Gao 002; Yunbo He; Ching-Ping Wong (IEEE Access, 2020)

Intensity Modulated Gas RI Sensor Based on Inornate Antiresonant Hollow-Core Fiber With Ultrahigh Sensitivity. - Maoxiang Hou; Neng Wang; Jianguo Ma; Yun Chen 002; Xin Chen 005 (IEEE Access, 2021)

A VCM Active Actuation Method for Bonding Time Reduction in Chip Packaging Process. - Lanyu Zhang; Jian Gao 002; Yunbo He; Xin Chen 005; Yun Chen 002; Hui Tang 003; Zhijun Yang (IEEE Trans. Ind. Electron., 2021)

A Novel Defocus-Degree-Based Phase Unwrapping and Fusion Algorithm for High-Speed and Large-Depth-Range 3D Measurement. - Zhuojun Zheng; Jian Gao 002; Lanyu Zhang; Xin Chen 005; Yun Chen 002 (IEEE Trans. Ind. Electron., 2023)

A High-Efficiency Searching Time Reduction Method for VCM Soft-Landing Operation During Chip Bonding. - Lanyu Zhang; Jian Gao 002; Yun Chen 002; Xin Chen 005; Yunbo He (IEEE Trans. Ind. Electron., 2023)

Design and implementation of a precision levelling composite stage with active passive vibration isolation. - Lanyu Zhang; Shaoxuan Zhang; Jian Gao 002; Junhao Yi; Hao Wen 011; Yun Chen 002; Xin Chen 005 (Robotics Comput. Integr. Manuf., 2024)