The experimental analysis and the mechanical model for the debonding failure of TSV-Cu/Si interface. - Si Chen 007; Zhizhe Wang; Yunfei En; Yun Huang 006; Fei Qin; Tong An (Microelectron. Reliab., 2018)

Simulation Analysis of Mechanical Response of Wire Bonding in SiP under Thermal-mechanical-electrical Coupling Load. - Fangzhou Chen; Si Chen 007; Bin Zhou; Yun Huang 006; Fei Qin (ICTA, 2020)