Study on Complementary Auxiliary Cathode Method for Improving the Microstructure Uniformity of Electroplated Thick Metal Film. - Tan Yin; Yunna Sun; Yan Wang; Guifu Ding; Mingyu Zhang (NEMS, 2023)

Numerical simulation of copper electrodeposition for Through Silicon Via (TSV) with SPS-PEG-Cl additive system. - Yanan Tao; Chao Liang; Ziqi Mei; Zhiqiang Song; Yu Wu; Yunna Sun; Wenqiang Zhang; Yong Ruan; Xiaoguang Zhao (Microelectron. J., 2024)