Failure mechanism of FBGA solder joints in memory module subjected to harmonic excitation. - Yusuf Cinar; Jinwoo Jang; Gunhee Jang; Seonsik Kim; Jaeseok Jang; Jinkyu Chang; Yonghyun Jun (Microelectron. Reliab., 2012)

Effect of solder pads on the fatigue life of FBGA memory modules under harmonic excitation by using a global-local modeling technique. - Yusuf Cinar; Jinwoo Jang; Gunhee Jang; Seonsik Kim; Jaeseok Jang (Microelectron. Reliab., 2013)

Enhancing multimedia QoE via more effective time synchronisation over 802.11 networks. - Jonathan Shannon; Padraig O. Flaithearta; Yusuf Cinar; Hugh Melvin (MMSys, 2016)

Improved Jitter Buffer Management for WebRTC. - Yusuf Cinar; Peter Pocta; Desmond Chambers; Hugh Melvin (ACM Trans. Multim. Comput. Commun. Appl., 2021)

Analysis of SSD Acoustic Noise Generation Mechanism depending on NAND operation. - Yusuf Cinar; Junghoon Kim; Eunho Oh; Sungki Lee; Changsik Kwon; Jonggyu Park (IRPS, 2023)