Studies on solder bump electromigration in Cu/Sn-3Ag-0.5Cu/Cu system. - Kimihiro Yamanaka; Yutaka Tsukada; Katsuaki Suganuma (Microelectron. Reliab., 2007)

Influence of crystallographic orientation of Sn-Ag-Cu on electromigration in flip-chip joint. - Kiju Lee; Keun-Soo Kim; Yutaka Tsukada; Katsuaki Suganuma; Kimihiro Yamanaka; Soichi Kuritani; Minoru Ueshima (Microelectron. Reliab., 2011)