A Non-Invasive Pre-Bonding Screening Method for Cascaded SOA-Based Photonic Integrated Circuits. - Xudong Wang; Bin Shi; Lin Liu; Yutang Ye; Yong Liu; Ripalta Stabile (PSC, 2023)

A Strategy for Real-Time Suppressing the Fluctuation of DFB Chip Microcharacter Spotting Accuracy in Optical Device Packaging. - Xudong Wang; Lin Liu; Juanxiu Liu; Yuanhao Zhou; Xiaohui Du; Jing Zhang 043; Hongfei Du; Yutang Ye; Yong Liu (IEEE Trans. Instrum. Meas., 2024)

Optical Measurement for the Alarming Height of Silver Paste Overflow Surrounding APD Chip in Optical Component Packaging. - Xudong Wang; Lin Liu; Juanxiu Liu; Jing Zhang 044; Xiaohui Du; Ziruo Zhang; Yutang Ye; Yong Liu (IEEE Trans. Instrum. Meas., 2025)