All-wet TSV filling with highly adhesive displacement plated Cu seed layer. - Kohei Ohta; Atsushi Hirate; Yuto Miyachi; Tomohiro Shimizu; Shoso Shingubara (3DIC, 2015)

A Proposal of Resilient Supply Chain Network Planning Method with Supplier Selection and Inventory Levels Determination Using Two-Stage Stochastic Programming. - Hibiki Kobayashi; Toshiya Kaihara; Daisuke Kokuryo; Rina Tanaka; Masashi Hara; Yuto Miyachi; Puchit Sariddichainunta (APMS (4), 2023)

Resilient Supply Chain Network Planning Method with Two-Stage Stochastic Programming: Extension to Multiple Product Supply Chains. - Toshiya Kaihara; Hibiki Kobayashi; Daisuke Kokuryo; Masashi Hara; Yuto Miyachi; Dickson Hideki Yamao; Puchit Sariddichainunta (APMS (2), 2024)