Acoustic analysis of an assembly: Structural identification by signal processing (wavelets). - Jean Augereau; Yves Ousten; Laurent Béchou; Yves Danto (Microelectron. Reliab., 2002)

High temperature reliability testing of aluminum and tantalum electrolytic capacitors. - A. Dehbi; Wolfgang Wondrak; Yves Ousten; Yves Danto (Microelectron. Reliab., 2002)

Evaluation of a micropackaging analysis technique by highfrequency microwaves. - Geneviève Duchamp; Yves Ousten; Yves Danto (Microelectron. Reliab., 2002)

Behavioral study of passive components and coating materials under isostatic pressure and temperature stress conditions. - B. Trégon; Yves Ousten; Yves Danto; Laurent Béchou; Bernard Parmentier (Microelectron. Reliab., 2002)

Application of Picosecond Ultrasonics to Non-Destructive Analysis in VLSI circuits. - G. Andriamonje; Vincent Pouget; Yves Ousten; Dean Lewis; Yves Danto; Jean-Michel Rampnoux; Younès Ezzahri; Stefan Dilhaire; Stéphane Grauby; Wilfrid Claeys (Microelectron. Reliab., 2003)

An improved method for automatic detection and location of defects in electronic components using scanning ultrasonic microscopy. - Laurent Béchou; Dominique Dallet; Yves Danto; Pasquale Daponte; Yves Ousten; Sergio Rapuano (IEEE Trans. Instrum. Meas., 2003)

Reliability of Low-Cost PCB Interconnections for Telecommunication Applications. - Geneviève Duchamp; Frédéric Verdier; Yannick Deshayes; François Marc; Yves Ousten; Yves Danto (Microelectron. Reliab., 2004)

Vibration lifetime modelling of PCB assemblies using steinberg model. - A. Dehbi; Yves Ousten; Yves Danto; Wolfgang Wondrak (Microelectron. Reliab., 2005)

Failure mechanisms and qualification testing of passive components. - H. A. Post; P. Letullier; T. Briolat; R. Humke; R. Schuhmann; K. Saarinen; W. Werner; Yves Ousten; G. Lekens; A. Dehbi (Microelectron. Reliab., 2005)

Use of signal processing imaging for the study of a 3D package in harsh environment. - Jean Augereau; Yves Ousten; Bruno Levrier; Laurent Béchou (Microelectron. Reliab., 2006)

Defect detection in multilayer ceramic capacitors. - V. Krieger; Wolfgang Wondrak; A. Dehbi; W. Bartel; Yves Ousten; Bruno Levrier (Microelectron. Reliab., 2006)

Reliability investigations of 850 nm silicon photodiodes under proton irradiation for space applications. - M. L. Bourqui; Laurent Béchou; Olivier Gilard; Yannick Deshayes; Pamela Del Vecchio; L. S. How; F. Rosala; Yves Ousten; André Touboul (Microelectron. Reliab., 2008)

Selective activation of failure mechanisms in packaged double-heterostructure light emitting diodes using controlled neutron energy irradiation. - Yannick Deshayes; Isabelle Bord-Majek; G. Barreau; M. Aiche; Philippe Moretto; Laurent Béchou; A. C. Roehrig; Yves Ousten (Microelectron. Reliab., 2008)

Effects of silicone coating degradation on GaN MQW LEDs performances using physical and chemical analyses. - Raphael Baillot; Yannick Deshayes; Laurent Béchou; T. Buffeteau; I. Pianet; C. Armand; F. Voillot; S. Sorieul; Yves Ousten (Microelectron. Reliab., 2010)

An original DoE-based tool for silicon photodetectors EoL estimation in space environments. - Piero Spezzigu; Laurent Béchou; Gianandrea Quadri; Olivier Gilard; Yves Ousten; Massimo Vanzi (Microelectron. Reliab., 2011)

Power MOSFET active power cycling for medical system reliability assessment. - Amadou Sow; Sinivassane Somaya; Yves Ousten; Jean-Michel Vinassa; Fanny Patoureaux (Microelectron. Reliab., 2013)

Photothermal activated failure mechanism in polymer-based packaging of low power InGaN/GaN MQW LED under active storage. - Raphael Baillot; Yannick Deshayes; Yves Ousten; Laurent Béchou (Microelectron. Reliab., 2015)

Liquid Crystal Polymer for QFN packaging: Predicted thermo-mechanical fatigue and Design for Reliability. - Walide Chenniki; Isabelle Bord-Majek; Mélanie Louarn; Vincent Gaud; Jean-Luc Diot; Komkrisd Wongtimnoi; Yves Ousten (Microelectron. Reliab., 2015)

A new non-magnetic trimmer for the magnetic resonance imaging system. - Zaineb Jebri; Isabelle Bord-Majek; Celine Delafosse; Christophe Pasquet; Yves Ousten (MOCAST, 2018)

Highlighting two integration technologies based on vias: Through silicon vias and embedded components into PCB. Strengths and weaknesses for manufacturing and reliability. - M. Balmont; Isabelle Bord-Majek; B. Poupard; Laurent Béchou; Yves Ousten (Microelectron. Reliab., 2018)