Advanced methods for mechanical and structural characterization of nanoscale materials for 3D IC integration. - Christoph Sander; Yvonne Standke; Sven Niese; Rüdiger Rosenkranz; André Clausner; Martin Gall; Ehrenfried Zschech (Microelectron. Reliab., 2014)

Analysis of electromigration-induced backflow stresses in Cu(Mn) interconnects using high statistical sampling. - Matthias Kraatz; Christoph Sander; André Clausner; Meike Hauschildt; Yvonne Standke; Martin Gall; Ehrenfried Zschech (IRPS, 2018)