Numerical simulation of self-alignment of chip resistor components for different silver content during reflow soldering. - A. M. Najib; Mohd Zulkifly Abdullah; Abdullah Aziz Saad; Z. Samsudin; F. Che Ani (Microelectron. Reliab., 2017)

No-flow underfill: Effect of chip placement speed on the void formation using numerical method. - Muhammad Naqib Nashrudin; Aizat Abas; M. Z. Abdullah; M. Yusuf Tura Ali; Z. Samsudin; Idris Mansor (Microelectron. J., 2021)