STAMP-2.5D: Structural and Thermal Aware Methodology for Placement in 2.5D Integration. - Varun Darshana Parekh; Zachary Wyatt Hazenstab; Srivatsa Rangachar Srinivasa; Krishnendu Chakrabarty; Kai Ni 004; Vijaykrishnan Narayanan (CoRR, 2025)