On-Line Transition-Time Monitoring for Die-to-Die Interconnects in 3D ICs. - Shi-Yu Huang; Hua-Xuan Li; Zeng-Fu Zeng; Kun-Han Tsai; Wu-Tung Cheng (ATS, 2014)

On-the-fly timing-aware built-in self-repair for high-speed interposer wires in 2.5-D ICs. - Shi-Yu Huang; Zeng-Fu Zeng; Kun-Han Tsai; Wu-Tung Cheng (ETS, 2014)

Nonintrusive On-Line Transition-Time Binning and Timing Failure Threat Detection for Die-to-Die Interconnects. - Shi-Yu Huang; Meng-Ting Tsai; Hua-Xuan Li; Zeng-Fu Zeng; Kun-Han Hans Tsai; Wu-Tung Cheng (IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2015)

General Timing-Aware Built-In Self-Repair for Die-to-Die Interconnects. - Shi-Yu Huang; Meng-Ting Tsai; Zeng-Fu Zeng; Kun-Han Hans Tsai; Wu-Tung Cheng (IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2015)