Invited - Cross-layer modeling and optimization for electromigration induced reliability. - Taeyoung Kim 001; Zeyu Sun 001; Chase Cook; Hengyang Zhao; Ruiwen Li; Daniel Wong 001; Sheldon X.-D. Tan (DAC, 2016)

Dynamic reliability management for near-threshold dark silicon processors. - Taeyoung Kim 001; Zeyu Sun 001; Chase Cook; Jagadeesh Gaddipati; Hai Wang 002; Hai-Bao Chen; Sheldon X.-D. Tan (ICCAD, 2016)

Voltage-based electromigration immortality check for general multi-branch interconnects. - Zeyu Sun 001; Ertugrul Demircan; Mehul D. Shroff; Taeyoung Kim 001; Xin Huang 003; Sheldon X.-D. Tan (ICCAD, 2016)

Finite difference method for electromigration analysis of multi-branch interconnects. - Chase Cook; Zeyu Sun 001; Taeyoung Kim 001; Sheldon X.-D. Tan (SMACD, 2016)

Dynamic temperature-aware reliability modeling for multi-branch interconnect trees. - Jiangtao Peng; Hai-Bao Chen; Hengyang Zhao; Zeyu Sun 001; Sheldon X.-D. Tan (ASICON, 2017)

Leveraging recovery effect to reduce electromigration degradation in power/ground TSV. - Shengcheng Wang; Zeyu Sun 001; Yuan Cheng; Sheldon X.-D. Tan; Mehdi Baradaran Tahoori (ICCAD, 2017)

Energy and Lifetime Optimizations for Dark Silicon Manycore Microprocessor Considering Both Hard and Soft Errors. - Taeyoung Kim 001; Zeyu Sun 001; Hai-Bao Chen; Hai Wang 002; Sheldon X.-D. Tan (IEEE Trans. Very Large Scale Integr. Syst., 2017)

Accelerating electromigration aging for fast failure detection for nanometer ICs. - Zeyu Sun 001; Sheriff Sadiqbatcha; Hengyang Zhao; Sheldon X.-D. Tan (ASP-DAC, 2018)

Electromigration-lifetime constrained power grid optimization considering multi-segment interconnect wires. - Han Zhou 002; Yijing Sun; Zeyu Sun 001; Hengyang Zhao; Sheldon X.-D. Tan (ASP-DAC, 2018)

Reliability Based Hardware Trojan Design Using Physics-Based Electromigration Models. - Chase Cook; Sheriff Sadiqbatcha; Zeyu Sun 001; Sheldon X.-D. Tan (SMACD, 2018)

Accelerating Electromigration Wear-Out Effects Based on Configurable Sink-Structured Wires. - Sheriff Sadiqbatcha; Chase Cook; Zeyu Sun 001; Sheldon X.-D. Tan (SMACD, 2018)

Detection of counterfeited ICs via on-chip sensor and post-fabrication authentication policy. - Taeyoung Kim 001; Sheldon X.-D. Tan; Chase Cook; Zeyu Sun 001 (Integr., 2018)

Recent advances in EM and BTI induced reliability modeling, analysis and optimization (invited). - Sheldon X.-D. Tan; Hussam Amrouch; Taeyoung Kim 001; Zeyu Sun 001; Chase Cook; Jörg Henkel (Integr., 2018)

Fast Electromigration Immortality Analysis for Multisegment Copper Interconnect Wires. - Zeyu Sun 001; Ertugrul Demircan; Mehul D. Shroff; Chase Cook; Sheldon X.-D. Tan (IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2018)

Fast Electromigration Stress Evolution Analysis for Interconnect Trees Using Krylov Subspace Method. - Chase Cook; Zeyu Sun 001; Ertugrul Demircan; Mehul D. Shroff; Sheldon X.-D. Tan (IEEE Trans. Very Large Scale Integr. Syst., 2018)

Recovery-Aware Proactive TSV Repair for Electromigration Lifetime Enhancement in 3-D ICs. - Shengcheng Wang; Taeyoung Kim 001; Zeyu Sun 001; Sheldon X.-D. Tan; Mehdi Baradaran Tahoori (IEEE Trans. Very Large Scale Integr. Syst., 2018)

Long-Term Reliability Management For Multitasking GPGPUs. - Zeyu Sun 001; Taeyoung Kim 001; Marcus Chow; Shaoyi Peng; Han Zhou 002; Hyoseung Kim 001; Daniel Wong 001; Sheldon X.-D. Tan (SMACD, 2019)

Dynamic Reliability Management for Multi-Core Processor Based on Deep Reinforcement Learning. - Zeyu Sun 001; Han Zhou 002; Sheldon X.-D. Tan (SMACD, 2019)

Saturation-Volume Estimation for Multisegment Copper Interconnect Wires. - Zeyu Sun 001; Sheriff Sadiqbatcha; Hengyang Zhao; Sheldon X.-D. Tan (IEEE Trans. Very Large Scale Integr. Syst., 2019)

EM-Aware and Lifetime-Constrained Optimization for Multisegment Power Grid Networks. - Han Zhou 002; Zeyu Sun 001; Sheriff Sadiqbatcha; Naehyuck Chang; Sheldon X.-D. Tan (IEEE Trans. Very Large Scale Integr. Syst., 2019)

Reliable Power Grid Network Design Framework Considering EM Immortalities for Multi-Segment Wires. - Han Zhou 002; Shuyuan Yu; Zeyu Sun 001; Sheldon X.-D. Tan (ASP-DAC, 2020)

EM-GAN: Data-Driven Fast Stress Analysis for Multi-Segment Interconnects. - Wentian Jin; Sheriff Sadiqbatcha; Zeyu Sun 001; Han Zhou 002; Sheldon X.-D. Tan (ICCD, 2020)

Interconnect Electromigration Modeling and Analysis for Nanometer ICs: From Physics to Full-Chip. - Sheldon X.-D. Tan; Zeyu Sun 001; Sheriff Sadiqbatcha (IPSJ Trans. Syst. LSI Des. Methodol., 2020)

Accelerating Electromigration Aging: Fast Failure Detection for Nanometer ICs. - Sheriff Sadiqbatcha; Zeyu Sun 001; Sheldon X.-D. Tan (IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2020)

Fast Analytic Electromigration Analysis for General Multisegment Interconnect Wires. - Liang Chen 025; Sheldon X.-D. Tan; Zeyu Sun 001; Shaoyi Peng; Min Tang; Junfa Mao (IEEE Trans. Very Large Scale Integr. Syst., 2020)

A Fast Semi-Analytic Approach for Combined Electromigration and Thermomigration Analysis for General Multisegment Interconnects. - Liang Chen 025; Sheldon X.-D. Tan; Zeyu Sun 001; Shaoyi Peng; Min Tang; Junfa Mao (IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2021)