High resolution AFM scanning Moiré method and its application to the micro-deformation in the BGA electronic package. - Huimin Xie; Anand K. Asundi; Chai Gin Boay; Lu Yunguang; Jin Yu; Zhaowei Zhong; Bryan K. A. Ngoi (Microelectron. Reliab., 2002)

Design For Board Level Reliability Of A Miniaturized Mems Package: Stacked Die Tqfn. - Tong Yan Tee; Giovanni Frezza; Mayhuan Lim; Hun Shen Ng; Federico Ziglioli; Zhaowei Zhong (Int. J. Comput. Eng. Sci., 2003)

Reliability assessment and hygroswelling modeling of FCBGA with no-flow underfill. - Tong Yan Tee; Chek Lim Kho; Daniel Yap; Carol Toh; Xavier Baraton; Zhaowei Zhong (Microelectron. Reliab., 2003)

Board level solder joint reliability modeling and testing of TFBGA packages for telecommunication applications. - Tong Yan Tee; Hun Shen Ng; Daniel Yap; Xavier Baraton; Zhaowei Zhong (Microelectron. Reliab., 2003)

Comprehensive board-level solder joint reliability modeling and testing of QFN and PowerQFN packages. - Tong Yan Tee; Hun Shen Ng; Daniel Yap; Zhaowei Zhong (Microelectron. Reliab., 2003)

Impact life prediction modeling of TFBGA packages under board level drop test. - Tong Yan Tee; Hun Shen Ng; Chwee Teck Lim; Eric Pek; Zhaowei Zhong (Microelectron. Reliab., 2004)

Integrated vapor pressure, hygroswelling, and thermo-mechanical stress modeling of QFN package during reflow with interfacial fracture mechanics analysis. - Tong Yan Tee; Zhaowei Zhong (Microelectron. Reliab., 2004)

Board level solder joint reliability analysis and optimization of pyramidal stacked die BGA packages. - Tong Yan Tee; Zhaowei Zhong (Microelectron. Reliab., 2004)

Huge Proteins in The Human Proteome and Their Participation in Hereditary Diseases. - Meena Kishore Sakharkar; Pandjassarame Kangueane; Kishore R. Sakharkar; Zhaowei Zhong (Silico Biol., 2006)

Effects of process conditions on reliability, microstructure evolution and failure modes of SnAgCu solder joints. - Periannan Arulvanan; Zhaowei Zhong; Xunqing Shi (Microelectron. Reliab., 2006)

Board level solder joint reliability analysis of stacked die mixed flip-chip and wirebond BGA. - Tong Yan Tee; Hun Shen Ng; Zhaowei Zhong (Microelectron. Reliab., 2006)

Dynamic responses and solder joint reliability under board level drop test. - Jing-en Luan; Tong Yan Tee; Eric Pek; Chwee Teck Lim; Zhaowei Zhong (Microelectron. Reliab., 2007)

Correlation analysis of cutting force and acoustic emission signals for tool condition monitoring. - Zhaowei Zhong; J.-H. Zhou; Ye Nyi Win (ASCC, 2013)

Nonlinearly enhanced vortex induced vibrations for energy harvesting. - Bao Huy Huynh; Tegoeh Tjahjowidodo; Zhaowei Zhong; Youyi Wang; Narasimalu Srikanth (AIM, 2015)

A customer-centric IoT-based novel closed-loop supply chain model for WEEE management. - Rui Guo; Zhaowei Zhong (Adv. Eng. Informatics, 2023)

Quantum Error Corrected Fidelity Routing Design for Long-Distance Quantum Networks. - Yuto Lim; Lishuai Yuan; Zhaowei Zhong (ICNC, 2024)