Wafer-level 3D integration using hybrid bonding. - Cheng-Ta Ko; Kuan-Neng Chen; Wei-Chung Lo; Chuan-An Cheng; Wen-Chun Huang; Zhi-Cheng Hsiao; Huan-Chun Fu; Yu-Hua Chen (3DIC, 2010)

Cu-based bonding technology for 3D integration applications. - Kuan-Neng Chen; Z. Xu; Fei Liu; Cheng-Ta Ko; Chuan-An Cheng; W. C. Huang; H. L. Lin; C. Cabral; Zhi-Cheng Hsiao; N. Klymko; Hsin-Chia Fu; Y. H. Chen; et al. (3DIC, 2011)

Wafer-level 3D integration with Cu TSV and micro-bump/adhesive hybrid bonding technologies. - Cheng-Ta Ko; Zhi-Cheng Hsiao; Y. J. Chang; Peng-Shu Chen; J. H. Huang; Hsin-Chia Fu; Y. J. Huang; C. W. Chiang; W. L. Tsat; Y. H. Chen; Wei-Chung Lo; Kuan-Neng Chen (3DIC, 2011)