Effects of Bi segregation on the tensile properties of Cu/Cu3Sn(1 0 0) interface. - X. Y. Pang; Zhi-Quan Liu; S. Q. Wang; J. K. Shang (Microelectron. Reliab., 2011)

Ex situ observations of fast intermetallic growth on the surface of interfacial region between eutectic SnBi solder and Cu substrate during solid-state aging process. - P. J. Shang; L. Zhang; Zhi-Quan Liu; J. Tan; J. K. Shang (Microelectron. Reliab., 2013)