Interfacial reaction between the electroless nickel immersion gold substrate and Sn-based solders. - Ruihong Zhang; Ran Zhao; Fu Guo; Zhidong Xia (Microelectron. Reliab., 2009)

Constitutive modeling on creep deformation for a SnPb-based composite solder reinforced with microsized Cu particles. - Yaowu Shi; Yanfu Yan; Jianping Liu; Zhidong Xia; Yongping Lei; Fu Guo; Xiaoyan Li (Microelectron. Reliab., 2010)