Top-down delayering to expose large inspection area on die side-edge with Platinum (Pt) deposition technique. - Huei Hao Yap; Pik Kee Tan; G. R. Low; M. K. Dawood; Hua Feng; Yuzhe Zhao; Ran He; Hao Tan; J. Zhu; Binghai Liu; Y. M. Huang; D. D. Wang; et al. (Microelectron. Reliab., 2015)

Electrical analysis on implantation-related defect by nanoprobing methodology. - Changqing Chen; P. T. Ng; Ghinboon Ang; H. Tan; Francis Rivai; Y. Z. Ma; Huipeng Ng; Jeffrey Lam; Zhihong Mai (Microelectron. Reliab., 2016)

Application of laser deprocessing technique in PFA on chemical over-etched on bond-pad issue. - Huei Hao Yap; Pik Kee Tan; Lei Zhu; H. Feng; Yuzhe Zhao; Ran He; Hao Tan; B. Liu; Y. M. Huang; D. D. Wang; Jeffrey Lam; Zhihong Mai (Microelectron. Reliab., 2016)

Application of Fast Laser Deprocessing Techniques on large cross-sectional view area sample with FIB-SEM dual beam system. - Yuzhe Zhao; Q. J. Wang; Pik Kee Tan; Huei Hao Yap; Binghai Liu; H. Feng; Hao Tan; Ran He; Y. M. Huang; D. D. Wang; Lei Zhu; C. Q. Chen; et al. (Microelectron. Reliab., 2016)

In-depth circuits edit analysis to reveal the implantation-related defect. - Changqing Chen; Ghim Boon Ang; Jeffrey Lam; Zhihong Mai (Microelectron. J., 2017)

Application of Scanning Capacitance Microscopy on SOI device with wafer edge low yield pattern. - Changqing Chen; Ghim Boon Ang; Peng Tiong Ng; Francis Rivai; Soh Ping Neo; Dayanand Nagalingam; Kim Hong Yip; Jeffery Lam; Zhihong Mai (Microelectron. Reliab., 2017)

Embed SRAM IDDOFF fail root cause identification by combination of device analysis and localized circuit analysis. - Changqing Chen; Ghim Boon Ang; Peng Tiong Ng; Francis Rivai; Hui Peng Ng; Alfred C. T. Quah; Angela Teo; Jeffery Lam; Zhihong Mai (Microelectron. Reliab., 2017)

Failure analysis methodology on donut pattern failure due to photovoltaic electrochemical effect. - Soh Ping Neo; Alfred C. T. Quah; Ghim Boon Ang; Dayanand Nagalingam; Hnin Hnin Ma; Siong Luong Ting; C. W. Soo; Changqing Chen; Zhihong Mai; Jeffrey Lam (Microelectron. Reliab., 2017)

Static fault localization of subtle metallization defects using near infrared photon emission microscopy. - Alfred C. T. Quah; Dayanand Nagalingam; Seung Je Moon; Edy Susanto; Ghim Boon Ang; Soh Ping Neo; Jeffrey Lam; Zhihong Mai (Microelectron. Reliab., 2017)

Change Detection in Optical Remote Sensing Images with a Fully Object-Level Approach. - Long Ma 003; Zhihong Mai; He Chen 004; Wenchao Liu 001; Fan Feng; Guichi Liu; Nouman Qadeer Soomro (IGARSS, 2018)

Failure analysis on 14 nm FinFET devices with ESD CDM failure. - Shaalini Chithambaram; Pik Kee Tan; Yuzhe Zhao; Binghai Liu; Yinzhe Ma; Alfred Quah; Dayanand Nagalingam; Yanlin Pan; Zhihong Mai (Microelectron. Reliab., 2018)

Cross-sectional nanoprobing sample preparation on sub-micron device with fast laser grooving technique. - Pik Kee Tan; Yuzhe Zhao; Francis Rivai; Binghai Liu; Yanlin Pan; Ran He; Hao Tan; Zhihong Mai (Microelectron. Reliab., 2018)

An intelligent Cable Detection System in Shallow Water Area. - Zhihong Mai; Quanzhong Zhao; Zheng Liu; Weisheng Hou; Liang Zeng (AIAM (ACM), 2021)