Noninvasive in Vivo Study of the Morphology and Mechanical Properties of Plantar Fascia Based on Ultrasound. - Kunyang Wang; Jing Liu 040; Jianan Wu; Zhihui Qian; Luquan Ren; Lei Ren 002 (IEEE Access, 2019)

Subject-Specific Finite Element Modeling of the Human Shoulder Complex Part 2: Quantitative Evaluation of the Effect of Rotator Cuff Tear Propagation on Glenohumeral Joint Stability. - Manxu Zheng; Zhihui Qian; Zhenmin Zou; Chris Peach; Lei Ren 002 (IEEE Access, 2019)

Towards a 3D passive dynamic walker to study ankle and toe functions during walking motion. - Kunyang Wang; Pablo Tena Tobajas; Jing Liu 040; Tao Geng; Zhihui Qian; Lei Ren 002 (Robotics Auton. Syst., 2019)

In Vivo Assessment of Lower Limb Muscle Stress State Based on Shear Wave Elastography. - Jing Liu 040; Kunyang Wang; Jianan Wu; Huaibin Miao; Zhihui Qian; Luquan Ren; Lei Ren 002 (IEEE Access, 2020)

Association Between Pain in Knee Osteoarthritis and Mechanical Properties of Soft Tissue Around Knee Joint. - Jianan Wu; Zhihui Qian; Ruixia Xu; Jing Liu 040; Luquan Ren; Lei Ren 002 (IEEE Access, 2021)

Torque Curve Optimization of Ankle Push-Off in Walking Bipedal Robots Using Genetic Algorithm. - Qiaoli Ji; Zhihui Qian; Lei Ren 002; Luquan Ren (Sensors, 2021)

A New 3D Printed Passive Flexible Prosthesis Based on the Human Foot. - Jianqiao Jin; Kunyang Wang; Lei Ren 002; Zhihui Qian; Wei Liang; Wei Chen; Xuewei Lu; Di Zhao (ICIRA (4), 2022)

A Novel Metamorphic Foot Mechanism With Toe Joints Based on Spring-Loaded Linkages. - Jianwei Sun; Zhenyu Wang; Meiling Zhang; Songyu Zhang; Zhihui Qian; Jinkui Chu (IEEE Robotics Autom. Lett., 2023)

Body Weight Estimation Using Virtual Anthropometric Measurements From a Single Image. - Jin Sui; Chunguang Bu; Xingang Zhao; Chen Liu 016; Lei Ren 002; Zhihui Qian (IEEE Trans. Instrum. Meas., 2023)

A Multiaxial Bionic Ankle Based on Series Elastic Actuation With a Parallel Spring. - Shun Zhao; Wei Liang; Kunyang Wang; Lei Ren 002; Zhihui Qian; Guangrong Chen; Xuewei Lu; Di Zhao; Xu Wang 046; Luquan Ren (IEEE Trans. Ind. Electron., 2024)