The experimental analysis and the mechanical model for the debonding failure of TSV-Cu/Si interface. - Si Chen 007; Zhizhe Wang; Yunfei En; Yun Huang 006; Fei Qin; Tong An (Microelectron. Reliab., 2018)

Study on the electrical breakdown failure mode transition of TSV-RDL. - Tao Gong; Si Chen; Kai Li; Guoyuan Li; Zhizhe Wang; Xiaofeng Yang; Xiaodong Jian; Zhiwei Fu (Microelectron. J., 2023)

Four-Port Asymmetric Correction for Simultaneous Multicomponent EM-Field Measurement. - Wei-Heng Shao; Caixu Yu; Duan Nie; Zhizhe Wang; Xinxin Tian; Lei Wang 092 (IEEE Trans. Instrum. Meas., 2024)