Zhong Chen

According to our database, Zhong Chen authored at least 8 papers between 2009 and 2016.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2016

Atmospheric corrosion resistance of electroplated Ni/Ni-P/Au electronic contacts.

Vinod K. Murugan, Zhigang Jia, Govindo J. Syaranamual, Chee Lip Gan, Yizhong Huang, Zhong Chen

Microelectron. Reliab., 2016

Evaluation of the corrosion performance of Cu-Al intermetallic compounds and the effect of Pd addition.

Adeline B. Y. Lim, Wei Jian Neo, Oranna Yauw, Bob Chylak, Chee Lip Gan, Zhong Chen

Microelectron. Reliab., 2016

Interfacial evolution and bond reliability in thermosonic Pd coated Cu wire bonding on aluminum metallization: Effect of palladium distribution.

Adeline B. Y. Lim, Chris B. Boothroyd, Oranna Yauw, Bob Chylak, Chee Lip Gan, Zhong Chen

Microelectron. Reliab., 2016

2014

Customized glass sealant for ceramic substrates for high temperature electronic application.

Ahmed Sharif, Chee Lip Gan, Zhong Chen

Microelectron. Reliab., 2014

Ultra-fine pitch palladium-coated copper wire bonding: Effect of bonding parameters.

Adeline B. Y. Lim, Andrew C. K. Chang, Oranna Yauw, Bob Chylak, Chee Lip Gan, Zhong Chen

Microelectron. Reliab., 2014

2013

Simulation of bleeder flow and curing of thick composites with pressure and temperature dependent properties.

A. S. Ganapathi, Sunil C. Joshi, Zhong Chen

Simul. Model. Pract. Theory, 2013

2011

Effect of bonding duration and substrate temperature in copper ball bonding on aluminium pads: A TEM study of interfacial evolution.

H. Xu, C. Liu, Vadim V. Silberschmidt, Zhong Chen, J. Wei, M. Sivakumar

Microelectron. Reliab., 2011

2009

Underfill selection methodology for fine pitch Cu/low-k FCBGA packages.

Xuefen Ong, Soon Wee Ho, Yue Ying Ong, Leong Ching Wai, Kripesh Vaidyanathan, Yeow Kheng Lim, David Yeo, Kai Chong Chan, Juan Boon Tan, Dong Kyun Sohn, Liang Choo Hsia, Zhong Chen

Microelectron. Reliab., 2009