Underfill selection methodology for fine pitch Cu/low-k FCBGA packages. - Xuefen Ong; Soon Wee Ho; Yue Ying Ong; Leong Ching Wai; Kripesh Vaidyanathan; Yeow Kheng Lim; David Yeo; Kai Chong Chan; Juan Boon Tan; Dong Kyun Sohn; Liang Choo Hsia; Zhong Chen 004 (Microelectron. Reliab., 2009)

Effect of bonding duration and substrate temperature in copper ball bonding on aluminium pads: A TEM study of interfacial evolution. - H. Xu; C. Liu; Vadim V. Silberschmidt; Zhong Chen 004; Jun Wei; M. Sivakumar (Microelectron. Reliab., 2011)

Simulation of bleeder flow and curing of thick composites with pressure and temperature dependent properties. - A. S. Ganapathi; Sunil C. Joshi; Zhong Chen 004 (Simul. Model. Pract. Theory, 2013)

Ultra-fine pitch palladium-coated copper wire bonding: Effect of bonding parameters. - Adeline B. Y. Lim; Andrew C. K. Chang; Oranna Yauw; Bob Chylak; Chee Lip Gan; Zhong Chen 004 (Microelectron. Reliab., 2014)

Customized glass sealant for ceramic substrates for high temperature electronic application. - Ahmed Sharif; Chee Lip Gan; Zhong Chen 004 (Microelectron. Reliab., 2014)

Interfacial evolution and bond reliability in thermosonic Pd coated Cu wire bonding on aluminum metallization: Effect of palladium distribution. - Adeline B. Y. Lim; Chris B. Boothroyd; Oranna Yauw; Bob Chylak; Chee Lip Gan; Zhong Chen 004 (Microelectron. Reliab., 2016)

Evaluation of the corrosion performance of Cu-Al intermetallic compounds and the effect of Pd addition. - Adeline B. Y. Lim; Wei Jian Neo; Oranna Yauw; Bob Chylak; Chee Lip Gan; Zhong Chen 004 (Microelectron. Reliab., 2016)

Atmospheric corrosion resistance of electroplated Ni/Ni-P/Au electronic contacts. - Vinod K. Murugan; Zhigang Jia; Govindo J. Syaranamual; Chee Lip Gan; Yizhong Huang; Zhong Chen 004 (Microelectron. Reliab., 2016)

Adaptive Fabrication of Electrochemical Chips with a Paste-Dispensing 3D Printer. - Ten It Wong; Candy Ng; Shengxuan Lin; Zhong Chen 004; Xiaodong Zhou (Sensors, 2024)