Room Temperature Cu-Cu Direct Bonding Using Wetting/Passivation Scheme for 3D Integration and Packaging. - Zhong-Jie Hong; Demin Liu; Shu-Ting Hsieh; Han-Wen Hu; Ming-Wei Weng; Chih-I Cho; Jui-Han Liu; Kuan-Neng Chen (VLSI Technology and Circuits, 2022)